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XDS H.110 cPCI MC3
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Product Part Number: 258L006 PC Form Factor: CompactPCI TDM Bus Type: H.110 Bus Capacities: H.110 - 4096 timeslots MC3 - 4846 timeslots Conferencing - 128 ports The
XDS MC3 board is capable of switching any of the 4096 local H.110 timeslots
onto any of the 4846 fiber-optic MC3 timeslots. 128 ports of conferencing
allow conferences as large as 64 participants each (or up to 42 simultaneous
smaller conferences). |
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Additional Product Specifications External Fiber Medium: Dual counter-rotating fiber rings SONET framing, OC3 bit rate of 155Mbps 2423 timeslots per ring Max distance between adjacent chassis in ring: 2000m Conferencing: 128 ports available via twin 64-port conference blocks Energy detection and DTMF tone detection/clamping per port Independent gain adjustments per port, or global conference gain adjustment Max single conference size: 64 parties Max simultaneous conferences: 42 Analog Audio Port : Type: Bi-directional, dry audio Configuration: 1/8" front panel jack Status Indicators: Configuration: Front panel LED indicators (3) Status: Ring 0 normal/failure, Ring 1 normal/failure, Processor status Temperature Extremes: Operating: 0°C (+32°F) to +50°C (+122°F) Storage: -40°C (-40°F) to +70°C (+158°F) Ambient Humidity: Designed to withstand ambient relative humidity from 0% to 95% non-condensing in both operating and storage conditions. Mechanical: Designed to conform to PICMG® mechanical specifications for 6U CompactPCI cards. MTBF: 50,000 hours Electrical Requirements: +5 volts +5% @ 4.0amps maximum -12 volts +5% @ 15m maximum +12 volts and -5 volts are not required.
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