XDS H.100 PCI MC3 Lite
Multi-Chassis Board
 



 
 
Product Part Number: 257L036

PC Form Factor: full-length PCI
TDM Bus Type: H.100

Bus Capacities:
H.100 - 4096 timeslots
MC3 - 4846 timeslots

The XDS MC3 Lite board is capable of switching any of the 4096 local H.100 timeslots onto any of the 4846 fiber-optic MC3 timeslots.

Click here to download the XDS H.100 MC3 Lite technical manual

Click here to download additional application notes for MC3 Lite fiber ring redundancy and failure recovery schemes

  
Additional Product Specifications

External Fiber Medium:
Dual counter-rotating fiber rings
SONET framing, OC3 bit rate of 155Mbps
2423 timeslots per ring
Max distance between adjacent chassis in ring: 2000m

 Temperature Extremes:
Operating: 0°C (+32°F) to +50°C (+122°F)
Storage: -40°C (-40°F) to +70°C (+158°F)

Ambient Humidity:
Designed to withstand ambient relative humidity from 0% to 95% non-condensing in both operating and storage conditions.

Mechanical:
Designed to conform to PCI-SIG mechanical specifications for full-length PCI cards.

MTBF:
50,000 hours

Electrical Requirements:
+5 volts +5% @ 4.0 amps maximum
-12 volts @ 15mA maximum
+3.3 volts, -5 volts, and +12 volts are not required.