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XDS H.100 PCI MC3
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Product Part Number: 257L002 PC Form Factor: full-length PCI TDM Bus Type: H.100 Bus Capacities: H.100 - 4096 timeslots MC3 - 4846 timeslots Conferencing - 256 ports The
XDS MC3 board is capable of switching any of the 4096 local H.100 timeslots
onto any of the 4846 fiber-optic MC3 timeslots. 256 ports of non-blocking
conferencing allow conferences as large as 256 participants (or up to
84 simultaneous smaller conferences). |
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Additional Product Specifications External Fiber Medium: Dual counter-rotating fiber rings SONET framing, OC3 bit rate of 155Mbps 2423 timeslots per ring Max distance between adjacent chassis in ring: 2000m Conferencing: 256 ports non-blocking Energy detection and DTMF tone detection/clamping per port Independent attenuation adjustments per port, or global conference adjustment Max single conference size: 256 parties Max simultaneous conferences: 84 Analog Audio Port : Type: Bi-directional, dry audio Configuration: 1/8" rear panel jack Temperature Extremes: Operating: 0°C (+32°F) to +50°C (+122°F) Storage: -40°C (-40°F) to +70°C (+158°F) Ambient Humidity: Designed to withstand ambient relative humidity from 0% to 95% non-condensing in both operating and storage conditions. Mechanical: Designed to conform to PCI-SIG mechanical specifications for full-length PCI cards. MTBF: 50,000 hours Electrical Requirements: +5 volts +5% @ 4.0 amps maximum -12 volts @ 15mA maximum +3.3 volts, -5 volts, and +12 volts are not required.
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