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H.110 CompactPCI Multi-Chassis Interconnect Board H.110 CompactPCI High Density BRI ISDN Board
H.110 CompactPCI High Density Basic Rate ISDN Board The XDS H.110 CompactPCI High Density BRI board utilizes proven XDS core processor and ECTF H.110 technology. The XDS H.110 CompactPCI BRI board includes 32 (2B+D) BRI S/T ports. Each port may be individually configured as TE or NT. This board also includes protocol support for NI-1, NI-2, AT&T custom, Euro ISDN, and INS-Net 64 on board, plus HDLC controllers to allow transmission over the B or D channels. This board includes TEI management, message buffering, LAPD protocol support. The XDS H.110 CompactPCI BRI board includes DTMF generation and detection, along with call progress tone generation, and line energy detection. Driver support for the board includes Windows NT and Unix. The XDS H.110 CompactPCI BRI board utilizes PCI and CompactPCI technology, advancing AMTELCO XDS boards to the next level. These boards are ECTF H.100 and H.110 compliant. The H.110 CompactPCI BRI board is hot swap compliant. The XDS H.110 CompactPCI BRI board is designed to be compatible with other XDS boards, and other H.110 compliant products. AMTELCO fully supports compatible products from the multi vendor integration manufacturers. This makes it possible to construct a complex computer telephony system with a minimum of software effort.
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H.110 CompactPCI High Density Basic Rate ISDN Board |
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