AMTELCO Announces NEW XDS H.100 PCI MC3 Lite Board

McFarland, WI - February 2001 - AMTELCO proudly announces the new XDS Infinity Series H.100 PCI MC3 Lite Multi-Chassis Interconnect board. The XDS Multi-Chassis Interconnect boards make it possible for developers to expand their applications beyond a single chassis, allowing for maximum system expansion.

For communication between 20+ chassis, the XDS H.100 PCI MC3 Lite board can provide fully dynamic timeslot switching from one chassis to another. Communication between the XDS board and the software application is accomplished through dual-ported RAM. The multi-chassis bus includes a total of 4,846 timeslots, allowing up to 2,423 full duplex connections between either local or off-site locations. The board utilizes dual counter rotating OC3 fiber rings to connect from one chassis to the next, with chassis located up to 2,000 meters apart. Driver support for Windows® NT®, Windows 2000, Unixware, SCO Unix, and Linux is available.

AMTELCO also offers standard XDS MC-3 boards, which include all the features of the MC3 Lite board (including the dual fiber rings), as well as 128 ports of enhanced conferencing and an analog music-on-hold port. In addition, AMTELCO XDS also offers an XDS MC3 UltraLite board which includes a single fiber ring, along with all the other capabilities of the MC3 Lite board.

The XDS H.100 PCI MC3 Lite board is fully compatible with other XDS products, including the XDS MC3 ISA board, and other H.100 compliant products. This H.100 board can be used with MVIP or SCSA boards with an XDS H.100 to MVIP or H.100 to SCSA Interface connection. AMTELCO fully supports compatible products from the multi-vendor integration manufacturers.

For more information on the AMTELCO XDS Infinity Series H.100 PCI MC3 Lite Multi-Chassis Interconnect board, call (800)356-9224 or (608)838-4194.