Spring 2001
Fall 2000
Spring 2000
Fall 1999

• XDS H.110 CompactPCI High Density BRI board
  

• Checkout the NEW H.100 PCI Board!
  

• H.100 MC-3 Multi-Chassis Provides Solutions
  

• NEW PBX on Board

• More than one chassis for your application, or DID, or E&M trunks
  

• MVIP Developers who need more than one chassis for their application.
  

• AG Communications selects AMTELCO XDS
  

• H.100 to SC Bus TDM Bus Adapter

• H.100 to MVIP TDM Bus Adapter

callcenter solutions | contact center solutions |
executive suite solutions | 1call solutions | xds technologies solutions

©2001 American-Tel-A-Systems, Inc.